NXP Semiconductors
BAP65-02
Silicon PIN diode
? NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2010
Document identifier: BAP65-02
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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